Defect Analysis

Pie + wafer map

Type distribution + wafer-map spatial view. Filter scatter by defect type.

all Particle Pattern Scratch Spot EdgeDefect Residue

Defect type distribution

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Wafer map — Particle

Normalized (x, y), notch at bottom. Color = severity. Dot size ∝ defect size (µm). Spatial signature reads: uniform = random particulate; center cluster → lithography focus drift; edge ring → etch / CMP edge effect; radial → wafer handler. Current data is uniform — DBSCAN cluster labelling would make signature classification automated.

Wafer map Particle

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Top 5 defect × severity

Type	Severity	Count	Avg size (µm)	Share
Particle	major	10,393	5.44	23.0%
Pattern	major	5,929	5.46	13.1%
Scratch	major	4,539	5.44	10.0%
Particle	minor	3,978	2.19	8.8%
Spot	major	3,730	5.42	8.3%

Top 5 defect × severity

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